Key advantages of the MCX75310AAC-HEAT Network Card
The MCX75310AAC-HEAT delivers 400G NDR InfiniBand connectivity, establishing a foundational layer for ultra-fast communication between GPU servers, storage systems, and compute nodes. By eliminating data bottlenecks, this adapter ensures that complex artificial intelligence models and high-performance computing clusters receive data exactly when they need it, drastically accelerating overall processing times and improving computational efficiency.
Powered by the advanced NVIDIA ConnectX-7 architecture, the card supports a comprehensive suite of acceleration technologies. It natively integrates GPUDirect RDMA, standard RDMA, SHARP™, and advanced hardware acceleration. Furthermore, it deeply incorporates GPUDirect Storage and NVMe-oF technologies. This powerful combination completely offloads CPU workloads, allowing direct memory access between GPUs and storage devices, thereby maximizing application performance and minimizing latency across the entire network fabric.
Built on PCIe Gen5 technology, it provides exceptional bandwidth, scalability, and efficiency for AI, HPC, and data-intensive workloads. Beyond raw speed, the architecture prioritizes network integrity. It features built-in Secure Boot and hardware-level encryption (Crypto) capabilities. By supporting SR-IOV virtualization and unified network management platforms, administrators can achieve highly efficient operations while maintaining a strict zero-trust security environment.
Competitive Advantages of the MCX75310AAC-HEAT Network Card
When evaluating interconnect solutions for demanding enterprise environments, the MCX75310AAC-HEAT provides definitive 400G NDR bandwidth, delivering significantly higher throughput than previous-generation HDR 200G solutions for AI training and large-scale computing environments where every microsecond dictates operational success.
Superior Interconnect Efficiency
Compared with traditional Ethernet-based networking, InfiniBand offers intrinsically lower latency, higher transmission efficiency, and superior GPU-to-GPU communication performance, making it the preferred interconnect for AI and HPC clusters. With GPUDirect RDMA and proprietary NVIDIA networking acceleration technologies, it minimizes CPU overhead and maximizes cluster utilization, freeing up vital processing cycles for core computational tasks.
Broad Ecosystem Compatibility
To ensure smooth integration into diverse IT infrastructures, this network card boasts extensive compatibility across major operating systems, including widespread support for Linux, Windows, and VMware environments. On the physical layer, the precisely engineered port provides a solid, secure tactile connection, seamlessly interfacing with a wide variety of 400G OSFP optical modules as well as Direct Attach Copper (DAC) and Active Optical Cable (AOC) solutions, giving architects the flexibility to design optimal rack-level topologies.
Why Choose TELEFLY
TELEFLY is a trusted supplier of AI and data center infrastructure solutions, headquartered in Shenzhen with strategic operations in Hong Kong. Backed by our own dedicated server testing and repair facility, we provide genuine and fully tested GPUs, servers, switches, network adapters, optical modules, and storage products. Our technicians physically inspect every component, ensuring the gold contacts are pristine and the printed circuit boards are free from any micro-abrasions, guaranteeing that the hardware you receive performs exactly as specified.
With strong supply chain resources, ready inventory, global shipping capabilities, and professional technical support, TELEFLY delivers reliable, cost-effective, and one-stop solutions for AI, HPC, cloud computing, and enterprise data center deployments worldwide. Our packaging process utilizes anti-static, custom-molded foam inserts that protect sensitive components against shock and vibration during transit, ensuring your critical infrastructure arrives in immaculate condition and is ready for immediate deployment.
Comprehensive Technical Specifications & Operational Reliability
The physical construction of the MCX75310AAC-HEAT is engineered for demanding data center environments. It features a cool-to-the-touch, specialized RHS (Passive Heatsink) that efficiently dissipates thermal loads during intensive data transfers. The card is designed in a standard Half-Height, Half-Length (HHHL) PCIe form factor and comes standard with both tall and short mounting brackets, allowing for flexible installation across various high-density server chassis configurations.
Form Factor & Dimensions | Half-Height, Half-Length (HHHL) PCIe card with tall and short brackets included |
Thermal Solution | Exclusive RHS (Passive Heatsink) for optimal heat dissipation |
Power Consumption | Excellent energy efficiency with a typical power draw of approximately 25.9W |
Operating Environment | Supports wide temperature ranges from 0°C to 55°C and high-humidity conditions for 7x24 continuous operation |
Industry Compliance | Fully certified by CE, FCC, RoHS, and cTUVus, meeting strict global procurement standards |
Operating with an exceptional energy efficiency ratio, the adapter maintains a typical power consumption of just 25.9W. It is rigorously tested to withstand continuous 7x24 high-load operations in challenging environments, supporting a wide operating temperature range from 0°C to 55°C. Furthermore, the unit passes stringent international regulatory requirements, carrying CE, FCC, RoHS, and cTUVus certifications to meet the strict procurement access and environmental compliance standards of enterprise data centers globally.
